Resum: Abstract: Two-dimensional (2D) materials have outstanding physical, chemical and thermal properties that make them attractive for the fabrication of solid-state micro/nano-electronic devices and circuits. However, synthesizing high-quality 2D materials at the wafer scale is difficult, and integrating them in silicon microchips brings associated multiple challenges. Nevertheless, in the past few years substantial progress has been achieved and leading companies like TSMC, Intel and Samsung have started to work in this direction too. In this talk I will discuss how to integrate 2D materials in micro/nano-electronic devices, circuits, and microchips, giving a general overview of the global progress achieved in the field and presenting our last developments in hybrid 2D/CMOS applications. I will put special emphasis on devices and circuits for memristive technologies, including data storage, computation, encryption, and communication. I will also discuss the main technological challenges to face in the next years and provide some recommendations on how to solve them.

Link: https://www.ub.edu/in2ub/research-seminar-hybrid-2d-cmos-microchips-for-memristive-applications-20-03-204/.